Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/10135
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dc.contributor.authorThakur, Puneet Singhen_US
dc.contributor.authorBhatia, Vimalen_US
dc.date.accessioned2022-05-23T13:56:51Z-
dc.date.available2022-05-23T13:56:51Z-
dc.date.issued2022-
dc.identifier.citationThakur, P. S., Bhatia, V., Rajput, L. S., Rana, S., & Prakash, S. (2022). Laser Biospeckle Technique for Evaluating Biotic Stress on Seed Germination. 2022 Workshop on Recent Advances in Photonics (WRAP), 1�2. https://doi.org/10.1109/WRAP54064.2022.9758282en_US
dc.identifier.isbn978-1665407021-
dc.identifier.otherEID(2-s2.0-85129551717)-
dc.identifier.urihttps://doi.org/10.1109/WRAP54064.2022.9758282-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/10135-
dc.description.abstractTo assess the effect of biotic stress on the germination capability of seeds, laser biospeckle technique was used. Soybean seeds were artificially inoculated by Colletotrichum truncatum fungal spores and irradiated by laser light. Backscattered light from the seed was recorded in the form of speckle patterns and analyzed using subtraction average method of image analysis. It was found that the laser biospeckle technique exhibits strong potential for testing the pathogenicity of various fungi to various germplasm so that the resistivity of the germplasm towards the fungal pathogen can be estimated. © 2022 IEEE.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.source2022 Workshop on Recent Advances in Photonics, WRAP 2022en_US
dc.subjectCultivationen_US
dc.subjectLighten_US
dc.subjectSeeden_US
dc.subjectSpeckleen_US
dc.subjectBiospeckleen_US
dc.subjectBiospeckle techniquesen_US
dc.subjectBiotic stressen_US
dc.subjectColletotrichum truncatumen_US
dc.subjectFungi infectionsen_US
dc.subjectGermplasmsen_US
dc.subjectSeed germinationen_US
dc.subjectSeed lasersen_US
dc.subjectSoybeanen_US
dc.subjectSoybean seedsen_US
dc.subjectFungien_US
dc.titleLaser Biospeckle Technique for Evaluating Biotic Stress on Seed Germinationen_US
dc.typeConference Paperen_US
Appears in Collections:Department of Electrical Engineering

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