Please use this identifier to cite or link to this item:
https://dspace.iiti.ac.in/handle/123456789/10367
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Kushwaha, Ajay Kumar | - |
dc.contributor.author | Singh, Omkar | - |
dc.date.accessioned | 2022-06-20T10:13:11Z | - |
dc.date.available | 2022-06-20T10:13:11Z | - |
dc.date.issued | 2022-06-07 | - |
dc.identifier.uri | https://dspace.iiti.ac.in/handle/123456789/10367 | - |
dc.description.abstract | NA | en_US |
dc.language.iso | en | en_US |
dc.publisher | Department of Metallurgy Engineering and Materials Science, IIT Indore | en_US |
dc.relation.ispartofseries | MT221 | - |
dc.subject | Metallurgy Engineering and Materials Science | en_US |
dc.title | Electrochemical deposition of copper nano structures for lead-ion detection | en_US |
dc.type | Thesis_M.Tech | en_US |
Appears in Collections: | Department of Metallurgical Engineering and Materials Science_ETD |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
MT_221_Omkar_Singh_2002105012.pdf | 12.2 MB | Adobe PDF | View/Open |
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