Behavior of vapor chamber under transient heat flux conditions

Abstract

We are living in a technology driven world today and scientists are already able to fit the whole world in our pocket. Yes, I am talking about mobile phones. And they are trying to make it even smaller. But problem with these electronic devices like smartphones, laptops etc is that the more and more complex we are trying to make them, the more issue of heat problems we have to deal with. There is a lot of heat generation from a small heat source size. So, we are trying to keep the temperature as much in control as we can. For this, 2-dimensional heat spreading device, popularly known as vapor chamber is popular. A vapor chamber is a 2-dimensional device which also has a wick attached to its inner walls which is made up of porous material. The amount of heat which can be transferred by vapor chamber depends on several factors such as its and heat sink’s surface area, wick properties and working fluid. Our focus will be on working of vapor chambers in high heat flux conditions and we will be doing this indirect analysis of vapor chamber using software Ansys which we will use to do the direct analysis of copper spreader. We will change different parameters to see their effect on copper spreader and will use it to predict the performance of vapor chamber.