Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/12954
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dc.contributor.authorSharma, Ruchien_US
dc.date.accessioned2023-12-22T09:19:01Z-
dc.date.available2023-12-22T09:19:01Z-
dc.date.issued2023-
dc.identifier.citationSolanki, S., Singh, V., Gautam, S., Querol, J., & Chatzinotas, S. (2023). Short-Packet Communication Assisted Reliable Control of UAV for Optimum Coverage Range. IEEE International Conference on Communications. Scopus. https://doi.org/10.1109/ICC45041.2023.10279207en_US
dc.identifier.issn1976-1597-
dc.identifier.otherEID(2-s2.0-85174262709)-
dc.identifier.urihttps://doi.org/10.1080/19761597.2023.2268662-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/12954-
dc.description.abstractThis study uses patent citations data to measure knowledge spillovers at three levels: inventor, firm, and technology. We have collected Indian patents data granted by the United States Patent and Trademark Office (USPTO) and their backward citations from 1990 to 2019. To conduct our empirical analysis, we apply the Negative Binomial (NB) and Generalised Negative Binomial Model (GNBM). To account for other factors influencing knowledge spillovers, we control for patent inventor size, applicant size, patent scope, and claims. Our findings show that US-origin inventors outperform Indian and European inventors in terms of knowledge spillover from patent citations. Similarly, US firms show better knowledge spillover performance than Indian firms, foreign firms, Indian research centres, and other ownership categories. Lastly, the knowledge spillovers in chemistry technology patents are high compared to mechanical engineering, electrical engineering, and other technology categories from existing patent stock. The emperical finding of our study suggests that the government can promote knowledge spillovers from patent citations and advance India towards a knowledge-based economy by attracting foreign inventors and firms in the country, investing in domestic R&D, and developing human capital. © KOSIME, ASIALICS, STEPI 2023.en_US
dc.language.isoenen_US
dc.publisherRoutledgeen_US
dc.sourceAsian Journal of Technology Innovationen_US
dc.subjectfirmsen_US
dc.subjectinventoren_US
dc.subjectKnowledge spilloversen_US
dc.subjectnegative binomialen_US
dc.subjectUSPTOen_US
dc.titlePatent citations and knowledge spillovers: an empirical analysis of Indian patentsen_US
dc.typeJournal Articleen_US
Appears in Collections:School of Humanities and Social Sciences

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