Please use this identifier to cite or link to this item:
https://dspace.iiti.ac.in/handle/123456789/13342
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Times of India | - |
| dc.date.accessioned | 2024-04-01T07:28:32Z | - |
| dc.date.available | 2024-04-01T07:28:32Z | - |
| dc.date.issued | 2024-03-29 | - |
| dc.identifier.uri | http://dspace.iiti.ac.in:8080/jspui/handle/123456789/13342 | - |
| dc.language.iso | en | en_US |
| dc.publisher | Times of India (Indore) | en_US |
| dc.subject | Semiconductor Chip | en_US |
| dc.subject | MoU with DAVV and different Universities of Taiwan | en_US |
| dc.title | DAVV MoUs with varsities in Taiwan to bolster job prospects | en_US |
| dc.type | Newspaper Clipping | en_US |
| Appears in Collections: | 02_Year 2024 | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 20240329_Times_of_India_P-04.pdf | 374 kB | Adobe PDF | View/Open |
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