Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/17867
Title: Leveraging Multi-Layer Crypto-Logic Cross-Coupled with Encoded Code Converter and Conditional Control Flow for Robust Key-Based HLS IP Watermarking
Authors: Bhui, Nabendu
Sengupta, Anirban
Issue Date: 2025
Publisher: IEEE Computer Society
Citation: Bhui, N., & Sengupta, A. (2025). Leveraging Multi-Layer Crypto-Logic Cross-Coupled with Encoded Code Converter and Conditional Control Flow for Robust Key-Based HLS IP Watermarking. International System on Chip Conference. https://doi.org/10.1109/SOCC66126.2025.11235366
Abstract: Intellectual Property (IP) piracy and fraud IP ownership threats play a pivotal role in compromising the security of a system-on-chip (SoC) design. Further, these threats ominously jeopardize the reputation and goodwill of an IP vendor in the global design supply chain. Countering these hardware threats effectively is therefore the need of the hour. This paper introduces a novel key-based high-level synthesis (HLS) IP watermarking that leverages multi-layer crypto-logic cross-coupled with encoded code converter and conditional control flow. The proposed IP watermarking leverages several security layers such as: operation encoding rule, BCD conditional flow, Trifid cipher, code-converter, conditional control function, SLT immediate function, xor-ing, SHA function and watermark constraint embedding rule. The proposed watermarking is robust and provides boosted security in terms of lower probability of coincidence (digital evidence) and sturdier tamper tolerance than prior techniques, at zero design cost overhead. © 2025 IEEE.
URI: https://dx.doi.org/10.1109/SOCC66126.2025.11235366
https://dspace.iiti.ac.in:8080/jspui/handle/123456789/17867
ISBN: 9781538614907
9781467312950
9781479911660
9781457716164
9798350300116
9781728134826
9781538640333
9781665429313
9781479933785
9781467390934
ISSN: 2164-1676
Type of Material: Conference Paper
Appears in Collections:Department of Computer Science and Engineering

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