Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/18153
Title: FERMI-ML: A Flexible and Resource-Efficient Memory-In-Situ SRAM Macro for TinyML acceleration
Authors: Lokhande, Mukul
Sankhe, Akash
Jaya Chand, S.V.
Mishra, Shivangi
Vishvakarma, Santosh Kumar
Issue Date: 2025
Publisher: Institute of Electrical and Electronics Engineers Inc.
Citation: Lokhande, M., Sankhe, A., Jaya Chand, Mishra, S., & Vishvakarma, S. K. (2025). FERMI-ML: A Flexible and Resource-Efficient Memory-In-Situ SRAM Macro for TinyML acceleration. Proceedings of the International Conference on Microelectronics, ICM. https://doi.org/10.1109/ICM66518.2025.11321332
Abstract: The growing demand for low-power and area-efficient TinyML inference on AIoT devices necessitates memory architectures that minimise data movement while sustaining high computational efficiency. This paper presents FERMI-ML, a Flexible and Resource-Efficient Memory-In-Situ (MIS) SRAM macro designed for TinyML acceleration. The proposed 9T XNOR-based RX9T bit-cell integrates a 5T storage cell with a 4T XNOR compute unit, enabling variable-precision MAC and CAM operations within the same array. A 22-transistor (C22T) compressor-tree-based accumulator facilitates logarithmic 1-64-bit MAC computation with reduced delay and power compared to conventional adder trees. The 4 KB macro achieves dual functionality for in-situ computation and CAM-based lookup operations, supporting Posit-4/FP-4 precision. Post-layout results at 65 nm show operation at 350 MHz with 0.9 V, delivering a throughput of 1.93 TOPS and an energy efficiency of 364 TOPS/W, while maintaining a Quality-of-Result (QoR) above 97.5% with Inception-V4 and ResNet-18. FERMI-ML thus demonstrates a compact, reconfigurable, and energy-aware digital Memory-In-Situ macro capable of supporting mixed-precision TinyML workloads. © 2025 IEEE.
URI: https://dx.doi.org/10.1109/ICM66518.2025.11321332
https://dspace.iiti.ac.in:8080/jspui/handle/123456789/18153
ISBN: 979-833159370-4
ISSN: 2332-7014
Type of Material: Conference Paper
Appears in Collections:Department of Electrical Engineering

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