Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/18402
Title: Blind recognition of BCH and RS codes with interleaver parameter estimation: A deep learning and algebraic framework with hardware validation
Authors: Singh, Pranshu
Swaminathan, Ramabadran
Issue Date: 2026
Publisher: Elsevier B.V.
Citation: Singh, P., & R., S. (2026). Blind recognition of BCH and RS codes with interleaver parameter estimation: A deep learning and algebraic framework with hardware validation. Physical Communication, 77. https://doi.org/10.1016/j.phycom.2026.103146
Abstract: Blind estimation of code and interleaver parameters plays a vital role in various applications such as adaptive modulation and encoding, non-cooperative systems, reconfigurable radio systems, signal intelligence, etc. In this paper, we have proposed blind recognition algorithms for Bose-Chaudhuri-Hocquenghem (BCH) and Reed-Solomon (RS) codes, along with block and convolutional interleavers. Initially, deep learning frameworks are employed on the received data to classify the channel coding scheme and interleaver type. Further, we propose novel algorithms based on algebraic framework for recognition of code and interleaver parameters. Simulation results are provided for various test cases considering noisy channel conditions. Finally, the accuracy of classification and probability of correct recognition of code and interleaver parameters are given with detailed inferences. We have validated our findings by comparing the simulation results with those obtained using a USRP-based software-defined radio (SDR) setup, demonstrating that the real-time results closely match the simulation outcomes. Finally, the proposed algorithms outperform the existing methods for the joint recognition of code and interleaver parameters reported in the literature. © 2026 Elsevier B.V.
URI: https://dx.doi.org/10.1016/j.phycom.2026.103146
https://dspace.iiti.ac.in:8080/jspui/handle/123456789/18402
ISSN: 1874-4907
Type of Material: Journal Article
Appears in Collections:Department of Electrical Engineering

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