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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sengupta, Anirban | en_US |
dc.contributor.author | Roy, Dipanjan | en_US |
dc.date.accessioned | 2022-03-17T01:00:00Z | - |
dc.date.accessioned | 2022-03-17T15:34:55Z | - |
dc.date.available | 2022-03-17T01:00:00Z | - |
dc.date.available | 2022-03-17T15:34:55Z | - |
dc.date.issued | 2019 | - |
dc.identifier.citation | Sengupta, A., Roy, D., & Mohanty, S. P. (2019). Low-overhead robust RTL signature for DSP core protection: New paradigm for smart CE design. Paper presented at the 2019 IEEE International Conference on Consumer Electronics, ICCE 2019, doi:10.1109/ICCE.2019.8661835 | en_US |
dc.identifier.isbn | 9781538679104 | - |
dc.identifier.other | EID(2-s2.0-85063792695) | - |
dc.identifier.uri | https://doi.org/10.1109/ICCE.2019.8661835 | - |
dc.identifier.uri | https://dspace.iiti.ac.in/handle/123456789/4594 | - |
dc.description.abstract | The design process of smart Consumer Electronics (CE) devices heavily relies on reusable Intellectual Property (IP) cores of Digital Signal Processor (DSP) and Multimedia Processor (MP). On the other hand, due to strict competition and rivalry between IP vendors, the problem of ownership conflict and IP piracy is surging. Therefore, to design a secured smart CE device, protection of DSP/MP IP core is essential. Embedding a robust IP owner's signature can protect an IP core from ownership abuse and forgery. This paper presents a covert signature embedding process for DSP/MP IP core at Register-transfer level (RTL). The secret marks of the signature are distributed over the entire design such that it provides higher robustness. For example for 8th order FIR filter, it incurs only between 6% and 3% area overhead for maximum and minimum size signature respectively compared to the non-signature FIR RTL design but with significantly enhanced security. © 2019 IEEE. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | en_US |
dc.source | 2019 IEEE International Conference on Consumer Electronics, ICCE 2019 | en_US |
dc.subject | Digital devices | en_US |
dc.subject | Digital signal processors | en_US |
dc.subject | Embeddings | en_US |
dc.subject | FIR filters | en_US |
dc.subject | Intellectual property core | en_US |
dc.subject | Area overhead | en_US |
dc.subject | Design process | en_US |
dc.subject | Digital signal processors (DSP) | en_US |
dc.subject | Embedding process | en_US |
dc.subject | Low overhead | en_US |
dc.subject | Multimedia processors | en_US |
dc.subject | Register transfer level | en_US |
dc.subject | RTL designs | en_US |
dc.subject | Digital signal processing | en_US |
dc.title | Low-Overhead Robust RTL Signature for DSP Core Protection: New Paradigm for Smart CE Design | en_US |
dc.type | Conference Paper | en_US |
Appears in Collections: | Department of Computer Science and Engineering |
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