Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/4594
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dc.contributor.authorSengupta, Anirbanen_US
dc.contributor.authorRoy, Dipanjanen_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-17T15:34:55Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-17T15:34:55Z-
dc.date.issued2019-
dc.identifier.citationSengupta, A., Roy, D., & Mohanty, S. P. (2019). Low-overhead robust RTL signature for DSP core protection: New paradigm for smart CE design. Paper presented at the 2019 IEEE International Conference on Consumer Electronics, ICCE 2019, doi:10.1109/ICCE.2019.8661835en_US
dc.identifier.isbn9781538679104-
dc.identifier.otherEID(2-s2.0-85063792695)-
dc.identifier.urihttps://doi.org/10.1109/ICCE.2019.8661835-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/4594-
dc.description.abstractThe design process of smart Consumer Electronics (CE) devices heavily relies on reusable Intellectual Property (IP) cores of Digital Signal Processor (DSP) and Multimedia Processor (MP). On the other hand, due to strict competition and rivalry between IP vendors, the problem of ownership conflict and IP piracy is surging. Therefore, to design a secured smart CE device, protection of DSP/MP IP core is essential. Embedding a robust IP owner's signature can protect an IP core from ownership abuse and forgery. This paper presents a covert signature embedding process for DSP/MP IP core at Register-transfer level (RTL). The secret marks of the signature are distributed over the entire design such that it provides higher robustness. For example for 8th order FIR filter, it incurs only between 6% and 3% area overhead for maximum and minimum size signature respectively compared to the non-signature FIR RTL design but with significantly enhanced security. © 2019 IEEE.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.source2019 IEEE International Conference on Consumer Electronics, ICCE 2019en_US
dc.subjectDigital devicesen_US
dc.subjectDigital signal processorsen_US
dc.subjectEmbeddingsen_US
dc.subjectFIR filtersen_US
dc.subjectIntellectual property coreen_US
dc.subjectArea overheaden_US
dc.subjectDesign processen_US
dc.subjectDigital signal processors (DSP)en_US
dc.subjectEmbedding processen_US
dc.subjectLow overheaden_US
dc.subjectMultimedia processorsen_US
dc.subjectRegister transfer levelen_US
dc.subjectRTL designsen_US
dc.subjectDigital signal processingen_US
dc.titleLow-Overhead Robust RTL Signature for DSP Core Protection: New Paradigm for Smart CE Designen_US
dc.typeConference Paperen_US
Appears in Collections:Department of Computer Science and Engineering

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