Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/4633
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dc.contributor.authorSengupta, Anirbanen_US
dc.contributor.authorRoy, Dipanjanen_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-17T15:35:01Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-17T15:35:01Z-
dc.date.issued2018-
dc.identifier.citationSengupta, A., & Roy, D. (2018). Reusable intellectual property core protection for both buyer and seller. Paper presented at the 2018 IEEE International Conference on Consumer Electronics, ICCE 2018, , 2018-January doi:10.1109/ICCE.2018.8326059en_US
dc.identifier.isbn9781538630259-
dc.identifier.otherEID(2-s2.0-85048822168)-
dc.identifier.urihttps://doi.org/10.1109/ICCE.2018.8326059-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/4633-
dc.description.abstractThis paper presents a methodology for IP core protection of CE devices from both buyer's and seller's perspective. In the presented methodology, buyer fingerprint is embedded along seller watermark during architectural synthesis phase of IP core design. The buyer fingerprint is inserted during scheduling phase while seller watermark is implanted during register allocation phase of architectural synthesis process. The presented approach provides a robust mechanisms of IP core protection for both buyer and seller at zero area overhead, 1.1 % latency overhead and 0.95 % design cost overhead compared to a similar approach (that provides only protection to IP seller). © 2018 IEEE.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.source2018 IEEE International Conference on Consumer Electronics, ICCE 2018en_US
dc.subjectSalesen_US
dc.subjectArchitectural synthesisen_US
dc.subjectArea overheaden_US
dc.subjectCore designen_US
dc.subjectDesign costsen_US
dc.subjectRegister allocationen_US
dc.subjectRobust mechanismsen_US
dc.subjectIntellectual property coreen_US
dc.titleReusable intellectual property core protection for both buyer and selleren_US
dc.typeConference Paperen_US
Appears in Collections:Department of Computer Science and Engineering

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