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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kachave, Deepak | en_US |
| dc.contributor.author | Sengupta, Anirban | en_US |
| dc.date.accessioned | 2022-03-17T01:00:00Z | - |
| dc.date.accessioned | 2022-03-17T15:36:00Z | - |
| dc.date.available | 2022-03-17T01:00:00Z | - |
| dc.date.available | 2022-03-17T15:36:00Z | - |
| dc.date.issued | 2019 | - |
| dc.identifier.citation | Kachave, D., & Sengupta, A. (2019). Digital processing core performance degradation due to hardware stress attacks. IEEE Potentials, 38(2), 39-45. doi:10.1109/MPOT.2018.2850384 | en_US |
| dc.identifier.issn | 0278-6648 | - |
| dc.identifier.other | EID(2-s2.0-85062697117) | - |
| dc.identifier.uri | https://doi.org/10.1109/MPOT.2018.2850384 | - |
| dc.identifier.uri | https://dspace.iiti.ac.in/handle/123456789/4909 | - |
| dc.description.abstract | Nanoscale designs suffer from a major bottleneck of device aging that is characterized by its failure mechanism. Device aging may be caused by persistent device delay degradation that finally results in failure. Furthermore, some major factors that affect delay degradation are threshold voltage, temperature, and inputvector patterns. This phenomenon of accelerated aging through delay degradation can be easily exploited by a cyberat tacker who has knowledge of it. © 1988-2012 IEEE. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | en_US |
| dc.source | IEEE Potentials | en_US |
| dc.subject | Threshold voltage | en_US |
| dc.subject | Accelerated aging | en_US |
| dc.subject | Device aging | en_US |
| dc.subject | Failure mechanism | en_US |
| dc.subject | Major factors | en_US |
| dc.subject | Nano-scale design | en_US |
| dc.subject | Processing core | en_US |
| dc.subject | Failure (mechanical) | en_US |
| dc.title | Digital Processing Core Performance Degradation Due to Hardware Stress Attacks | en_US |
| dc.type | Journal Article | en_US |
| Appears in Collections: | Department of Computer Science and Engineering | |
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