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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kumar, Mukesh | en_US |
dc.date.accessioned | 2022-03-17T01:00:00Z | - |
dc.date.accessioned | 2022-03-17T15:39:07Z | - |
dc.date.available | 2022-03-17T01:00:00Z | - |
dc.date.available | 2022-03-17T15:39:07Z | - |
dc.date.issued | 2018 | - |
dc.identifier.citation | Kumar, M. (2018). On-chip nanophotonic devices for optical communication and interconnects. Paper presented at the 2018 3rd International Conference on Microwave and Photonics, ICMAP 2018, , 2018-January 1. doi:10.1109/ICMAP.2018.8354466 | en_US |
dc.identifier.isbn | 9781538609330 | - |
dc.identifier.other | EID(2-s2.0-85050918004) | - |
dc.identifier.uri | https://doi.org/10.1109/ICMAP.2018.8354466 | - |
dc.identifier.uri | https://dspace.iiti.ac.in/handle/123456789/5251 | - |
dc.description.abstract | On-chip nanophotonic devices are promising for next-generation communication systems and data centres which require guiding and controlling light at nano scales. Some nanophotonic devices with engineered and/or hybrid materials are proposed. A nanophotonic coupler with ultra-short coupling length of 0.461-μm is proposed. Also, photonic crystals based devices for delay tuning and for on-chip biosensing are proposed. © 2018 IEEE. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | en_US |
dc.source | 2018 3rd International Conference on Microwave and Photonics, ICMAP 2018 | en_US |
dc.subject | Hybrid materials | en_US |
dc.subject | Integrated circuit interconnects | en_US |
dc.subject | Nanophotonics | en_US |
dc.subject | Photonics | en_US |
dc.subject | Biosensing | en_US |
dc.subject | Coupling length | en_US |
dc.subject | Data centres | en_US |
dc.subject | Delay tuning | en_US |
dc.subject | Nano scale | en_US |
dc.subject | Nanophotonic devices | en_US |
dc.subject | On chips | en_US |
dc.subject | Optical communication | en_US |
dc.title | On-chip nanophotonic devices for optical communication and interconnects | en_US |
dc.type | Conference Paper | en_US |
Appears in Collections: | Department of Electrical Engineering |
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