Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/5296
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dc.contributor.authorKranti, Abhinaven_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-17T15:39:16Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-17T15:39:16Z-
dc.date.issued2017-
dc.identifier.citationLin, C. -., Lin, J. -., Lee, W. -., Huang, C. -., Chang, T. -., & Kranti, A. (2017). Punch-through reading mechanism and body raised up structure for a novel punch-through DRAM. Paper presented at the 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings, 866-868. doi:10.1109/ICSICT.2016.7999064en_US
dc.identifier.isbn9781467397179-
dc.identifier.otherEID(2-s2.0-85028637557)-
dc.identifier.urihttps://doi.org/10.1109/ICSICT.2016.7999064-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/5296-
dc.description.abstractIt is the first time, we propose a new reading mechanism for an ARAM-like 1T-DRAM by exploiting Punch-Through (PT) phenomenon. We simulated and investigated the results of a modified ARAM structure with respect to different channel length, channel thickness. We found that the structure has an acceptable programming window (33 μA/um) at shorter gate lengths. The retention time can be improved by using a raised P-body which is beneficial in achieving a retention time of 341 ms? © 2016 IEEE.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.source2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedingsen_US
dc.subject1t dramsen_US
dc.subjectChannel lengthen_US
dc.subjectChannel thicknessen_US
dc.subjectGate lengthen_US
dc.subjectProgramming windowen_US
dc.subjectPunch-throughen_US
dc.subjectRetention timeen_US
dc.subjectIntegrated circuitsen_US
dc.titlePunch-through reading mechanism and body raised up structure for a novel Punch-Through DRAMen_US
dc.typeConference Paperen_US
Appears in Collections:Department of Electrical Engineering

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