Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/5738
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dc.contributor.authorKranti, Abhinaven_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-17T15:43:36Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-17T15:43:36Z-
dc.date.issued2019-
dc.identifier.citationGupta, M., & Kranti, A. (2019). Relevance of device cross section to overcome boltzmann switching limit in 3-D junctionless transistor. IEEE Transactions on Electron Devices, 66(6), 2704-2709. doi:10.1109/TED.2019.2912209en_US
dc.identifier.issn0018-9383-
dc.identifier.otherEID(2-s2.0-85065914382)-
dc.identifier.urihttps://doi.org/10.1109/TED.2019.2912209-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/5738-
dc.description.abstractIn this paper, the requirements of device cross section and aspect ratio (AR) are examined to facilitate steep switching in heavily doped 3-D multiple gate junctionless (JL) transistors. It is shown through well-calibrated simulations and physical insights that the sharp OFF-to-ON switching action is predominantly governed by the area of cross section (Across}) instead of the gate length. A 3-D JL architecture preferably oriented toward a planar topology, i.e., with wider fin and low AR, is conducive for steep switching as a greater bulk area is available for impact ionization. On the contrary, narrow vertical architectures with AR > 1 suppress Across in the bulk and are less likely to support the steep current transition. Steep switching specific scaling methodology is showcased to attain a sharp increase in drain current with a sub-60 mV/decade swing in a tri-gate JL transistor along with an associated negative value of total gate capacitance. © 2019 IEEE.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.sourceIEEE Transactions on Electron Devicesen_US
dc.subjectAspect ratioen_US
dc.subjectDrain currenten_US
dc.subjectGermaniumen_US
dc.subjectLeakage currentsen_US
dc.subjectMOSFET devicesen_US
dc.subjectSiliconen_US
dc.subjectSwitchingen_US
dc.subjectCurrent transitionsen_US
dc.subjectGate capacitanceen_US
dc.subjectjunctionlessen_US
dc.subjectJunctionless transistoren_US
dc.subjectJunctionless transistorsen_US
dc.subjectScaling methodologyen_US
dc.subjectTri-gate MOSFETen_US
dc.subjectVertical architecturesen_US
dc.subjectImpact ionizationen_US
dc.titleRelevance of device cross section to overcome boltzmann switching limit in 3-D junctionless transistoren_US
dc.typeJournal Articleen_US
Appears in Collections:Department of Electrical Engineering

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