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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shah, Ambika Prasad | en_US |
dc.contributor.author | Vishvakarma, Santosh Kumar | en_US |
dc.date.accessioned | 2022-03-17T01:00:00Z | - |
dc.date.accessioned | 2022-03-17T15:43:45Z | - |
dc.date.available | 2022-03-17T01:00:00Z | - |
dc.date.available | 2022-03-17T15:43:45Z | - |
dc.date.issued | 2019 | - |
dc.identifier.citation | Yadav, N., Shah, A. P., Beohar, A., & Vishvakarma, S. K. (2019). Symmetric dual gate insulator-based FinFET module and design window for reliable circuits. Micro and Nano Letters, 14(3), 317-322. doi:10.1049/mnl.2018.5210 | en_US |
dc.identifier.issn | 1750-0443 | - |
dc.identifier.other | EID(2-s2.0-85062560066) | - |
dc.identifier.uri | https://doi.org/10.1049/mnl.2018.5210 | - |
dc.identifier.uri | https://dspace.iiti.ac.in/handle/123456789/5761 | - |
dc.description.abstract | High-k spacer and gate insulator materials have been exhaustively studied nowadays for the enhancement of electrostatic control and reduction of short-channel effects in scaled devices. The work presents a high-performance and charge trap tolerant FinFET module at 10 nm gate length. Dual layer gate insulator (inner low-k and outer high-k) introduces to reduce charge trapping from the channel and outside into the gate oxide. It reduces the gate leakage current by 51.6% compared to conventional FinFET. Further, they demonstrate single charge trapping (SCT) induce effects and proposed optimised high-k spacer width of the SCT tolerant design. SCT analysis is presented in different high-k spacer materials and back-gate voltages. Process variation sources such as line edge roughness and line width roughness are also analysed for the circuit design. © The Institution of Engineering and Technology 2018. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Institution of Engineering and Technology | en_US |
dc.source | Micro and Nano Letters | en_US |
dc.subject | Charge trapping | en_US |
dc.subject | Electrostatic devices | en_US |
dc.subject | Integrated circuit manufacture | en_US |
dc.subject | Leakage currents | en_US |
dc.subject | Roughness measurement | en_US |
dc.subject | Threshold voltage | en_US |
dc.subject | Timing circuits | en_US |
dc.subject | Back-gate voltages | en_US |
dc.subject | Electrostatic control | en_US |
dc.subject | Gate-leakage current | en_US |
dc.subject | Line Edge Roughness | en_US |
dc.subject | Linewidth roughness | en_US |
dc.subject | Process Variation | en_US |
dc.subject | Short-channel effect | en_US |
dc.subject | Spacer materials | en_US |
dc.subject | FinFET | en_US |
dc.subject | analytical error | en_US |
dc.subject | Article | en_US |
dc.subject | calibration | en_US |
dc.subject | electric potential | en_US |
dc.subject | electron | en_US |
dc.subject | equipment design | en_US |
dc.subject | simulation | en_US |
dc.subject | static electricity | en_US |
dc.title | Symmetric dual gate insulator-based FinFET module and design window for reliable circuits | en_US |
dc.type | Journal Article | en_US |
Appears in Collections: | Department of Electrical Engineering |
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