Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/5775
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dc.contributor.authorAwasthi, Vishnu Kumaren_US
dc.contributor.authorMukherjee, Shaibalen_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-17T15:43:50Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-17T15:43:50Z-
dc.date.issued2019-
dc.identifier.citationGarg, V., Sengar, B. S., Awasthi, V., Kumar, A., Pandey, S. K., Kumar, S., . . . Mukherjee, S. (2019). Investigation of valence electron excitation and plasmonic enhancement in sputter grown NMZO thin films: For energy harvesting applications. Optical Materials, 88, 372-377. doi:10.1016/j.optmat.2018.12.002en_US
dc.identifier.issn0925-3467-
dc.identifier.otherEID(2-s2.0-85058540872)-
dc.identifier.urihttps://doi.org/10.1016/j.optmat.2018.12.002-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/5775-
dc.description.abstractWe report a novel approach of sputter-stimulated plasmonic generation in Na-doped MgZnO (NMZO) thin films. Sputtering of material during film growth by utilizing secondary direct-coupled ion-source present in dual-ion beam sputtering system leads to the generation of nanoclusters of its constituent elements due to different sputtering-out rates of various elements present in the films. The authentication of plasmonic generation in NMZO is conducted as follows a) identification of plasmonic signature in electron energy loss spectra obtained by ultraviolet photoelectron spectroscopy measurement, b) valence bulk, valence surface, and particle plasmon resonance energy calculations are performed, and each plasmon peak is indexed with corresponding plasmon energy peak of different nanoclusters, and c) spectroscopic ellipsometric measurement is deployed to verify plasmonic behavior by investigating different optical properties. Additionally, incorporation of the plasmonic feature along with alkali metals plays a crucial role in the improvement of the performance of solar cells. Therefore, plasmon enhanced NMZO as a backscattering layer in between CIGSe/back contact is probed to ascertain the additional benefits of 1) Na incorporation into the absorber layer as a result of the Na diffusion from the NMZO layer, and 2) improvement in the morphology of the CIGSe thin film with the incorporation of NMZO layer in between the back-contact and CIGSe. The diffusion of Na into the absorber layer is probed by deploying secondary ion mass spectroscopy measurements, and improvement in the morphology of CIGSe with the incorporation of NMZO layer between the back-contact/absorber is investigated using field-emission scanning electron microscope analysis. © 2018 Elsevier B.V.en_US
dc.language.isoenen_US
dc.publisherElsevier B.V.en_US
dc.sourceOptical Materialsen_US
dc.subjectElectron energy loss spectroscopyen_US
dc.subjectEnergy dissipationen_US
dc.subjectEnergy harvestingen_US
dc.subjectFilm growthen_US
dc.subjectIon beamsen_US
dc.subjectIon sourcesen_US
dc.subjectMagnesium alloysen_US
dc.subjectNanoclustersen_US
dc.subjectNanostructured materialsen_US
dc.subjectOptical propertiesen_US
dc.subjectPhotoelectron spectroscopyen_US
dc.subjectPlasmonicsen_US
dc.subjectPlasmonsen_US
dc.subjectScanning electron microscopyen_US
dc.subjectSecondary ion mass spectrometryen_US
dc.subjectSemiconductor alloysen_US
dc.subjectSodiumen_US
dc.subjectSodium alloysen_US
dc.subjectSputteringen_US
dc.subjectUltraviolet photoelectron spectroscopyen_US
dc.subjectZinc alloysen_US
dc.subjectDual ion beam sputtering systemsen_US
dc.subjectElectron energy loss spectrumen_US
dc.subjectField emission scanning electron microscopesen_US
dc.subjectNMZOen_US
dc.subjectParticle plasmon resonanceen_US
dc.subjectSecondary ion mass spectroscopyen_US
dc.subjectSputtereden_US
dc.subjectUltra-thinen_US
dc.subjectThin filmsen_US
dc.titleInvestigation of valence electron excitation and plasmonic enhancement in sputter grown NMZO thin films: For energy harvesting applicationsen_US
dc.typeJournal Articleen_US
Appears in Collections:Department of Electrical Engineering

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