Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/8228
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dc.contributor.authorYadav, Ektaen_US
dc.contributor.authorSaseendra, Harisankaren_US
dc.contributor.authorSoni, Kavitaen_US
dc.contributor.authorMavani, Krushna R.en_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-21T11:15:41Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-21T11:15:41Z-
dc.date.issued2018-
dc.identifier.citationYadav, E., Harisankar, S., Soni, K., & Mavani, K. R. (2018). Influence of cu doping and thickness on non-fermi liquid behaviour and metallic conductance in epitaxial PrNiO3 thin films. Applied Physics A: Materials Science and Processing, 124(9) doi:10.1007/s00339-018-2038-yen_US
dc.identifier.issn0947-8396-
dc.identifier.otherEID(2-s2.0-85051698485)-
dc.identifier.urihttps://doi.org/10.1007/s00339-018-2038-y-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/8228-
dc.description.abstractWe have deposited two series (12 and 5 nm) of PrNi1−xCuxO3 (x = 0–0.1) thin films on (LaAlO3)0.3(Sr2Al-TiO6)0.7—(LSAT) single crystal substrate using pulsed laser deposition and studied the effect of Cu doping and thickness variation on the electronic properties. For series-1 (12 nm), the undoped PrNiO3 film shows a metal-to-insulator phase transition around 100K. A fractional doping of 1.0 atomic percentage of Cu at Ni-site is able to suppress the insulating phase completely and thereby driving the system towards steady metallicity throughout the temperature range below 300 K. However, at lower dimensions in series-2 with 5 nm thickness, these effects of Cu doping and metallicity are reduced. Resistivity data of all the films fit to power law equation show non-Fermi Liquid behaviour (NFL). A switching from one type of NFL to another type has been observed due to both, Cu doping and thickness variation. Further, the fitting parameters show a systemic variation with increasing Cu content indicating that the carrier injection by even a fractional Cu doping is highly effective in bringing metallicity in the system due to band filling effects. © 2018, Springer-Verlag GmbH Germany, part of Springer Nature.en_US
dc.language.isoenen_US
dc.publisherSpringer Verlagen_US
dc.sourceApplied Physics A: Materials Science and Processingen_US
dc.subjectAstrophysicsen_US
dc.subjectCopperen_US
dc.subjectElectronic propertiesen_US
dc.subjectFermi liquidsen_US
dc.subjectFermionsen_US
dc.subjectMetal insulator transitionen_US
dc.subjectNickel compoundsen_US
dc.subjectPraseodymium compoundsen_US
dc.subjectPulsed laser depositionen_US
dc.subjectSingle crystalsen_US
dc.subjectSubstratesen_US
dc.subjectThin filmsen_US
dc.subjectBand filling effectsen_US
dc.subjectCarrier injectionen_US
dc.subjectFitting parametersen_US
dc.subjectMetal-to-Insulator phase transitionen_US
dc.subjectNon-fermi liquid behavioursen_US
dc.subjectPower law equationen_US
dc.subjectSingle crystal substratesen_US
dc.subjectThickness variationen_US
dc.subjectSemiconductor dopingen_US
dc.titleInfluence of Cu doping and thickness on non-Fermi liquid behaviour and metallic conductance in epitaxial PrNiO3 thin filmsen_US
dc.typeJournal Articleen_US
Appears in Collections:Department of Physics

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