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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Deshmukh, Poonam S.;Tomar, K. P.;Sathiaraj, G. Dan;Palani, Anand Iyamperumal; | en_US |
| dc.date.accessioned | 2022-11-03T19:38:39Z | - |
| dc.date.available | 2022-11-03T19:38:39Z | - |
| dc.date.issued | 2022 | - |
| dc.identifier.citation | Deshmukh, P. S., Tomar, K., Sathiaraj, G. D., & Palani, I. A. (2022). Optimum strength and ductility of pure copper fabricated by wire arc additive manufacturing. Manufacturing Letters, 33, 24-28. doi:10.1016/j.mfglet.2022.06.005 | en_US |
| dc.identifier.issn | 2213-8463 | - |
| dc.identifier.other | EID(2-s2.0-85134252534) | - |
| dc.identifier.uri | https://doi.org/10.1016/j.mfglet.2022.06.005 | - |
| dc.identifier.uri | https://dspace.iiti.ac.in/handle/123456789/10775 | - |
| dc.description.abstract | The present study reports the feasibility of the Wire Arc Additive Manufacturing (WAAM) process to fabricate pure copper (Cu) wall structures. The process parameters that gave continuous tracks without any porosity and micro-cracks are used for layer-by-layer wall structure deposition. The scan and build direction have a UTS of 226.89 ± 4.28 MPa and 219.35 ± 1.41 MPa, along with an enhanced percentage elongation of 124.47 ± 8.65 % and 99.64 ± 16.47 %, respectively. © 2022 Society of Manufacturing Engineers (SME) | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Elsevier Ltd | en_US |
| dc.source | Manufacturing Letters | en_US |
| dc.subject | Additives; Copper; Deposition; Fabrication; Microstructure; Wire; Additive manufacturing process; Copper cu; Electron back-scattered diffraction; Micro cracks; Process parameters; Pure copper; Strength and ductilities; Wall structure; Wire arc; Wire arc additive manufacturing; 3D printers | en_US |
| dc.title | Optimum strength and ductility of pure copper fabricated by Wire Arc Additive Manufacturing | en_US |
| dc.type | Journal Article | en_US |
| Appears in Collections: | Department of Mechanical Engineering | |
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