Numerical simulation and experimental validation of wire arc additive manufacturing of pure copper

Abstract

Copper, known for its exceptional electrical and thermal conductivity, holds great potential for various industries. WAAM offers high deposition rates and the capability to manufacture intricate components. Nevertheless, during the WAAM process, continuous heat transfer to the workpiece and substrate can lead to the development of significant residual stresses within the component. To address this issue, preheating the substrate has proven effective in mitigating the formation of excessive residual stresses. In this study, copper bulk deposition is performed on both a substrate preheated to 300℃ and a non-preheated base plate. The two samples are subjected to subsequent mechanical and microstructural characterization to compare them. The preheated sample exhibits improvements in various aspects compared to the non-preheated sample. Specifically, the preheated sample demonstrates higher UTS of 280 MPa compared to 225 MPa in the non-preheated sample, increased hardness along the scanning direction (92 HV compared to 85 HV), and a higher coefficient of friction along the building direction (0.27 compared to 0.18) when compared to the non-preheated sample.