Please use this identifier to cite or link to this item:
https://dspace.iiti.ac.in/handle/123456789/13342
| Title: | DAVV MoUs with varsities in Taiwan to bolster job prospects |
| Authors: | Times of India |
| Keywords: | Semiconductor Chip;MoU with DAVV and different Universities of Taiwan |
| Issue Date: | 29-Mar-2024 |
| Publisher: | Times of India (Indore) |
| URI: | http://dspace.iiti.ac.in:8080/jspui/handle/123456789/13342 |
| Type of Material: | Newspaper Clipping |
| Appears in Collections: | 02_Year 2024 |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 20240329_Times_of_India_P-04.pdf | 374 kB | Adobe PDF | View/Open |
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