Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/14049
Title: ReCAM: Resistive RAM Digital Content Addressable Memory Using Novel 3T1R Bitcell
Authors: Sharma, Radheshyam
Dhakad, Narendra Singh
Reddy, Govindu Sathvik
Vishvakarma, Santosh Kumar
Keywords: non-volatile content addressable memory (nvCAM);Non-volatile memory (NVM);resistive RAM (ReRAM)
Issue Date: 2024
Publisher: Institute of Electrical and Electronics Engineers Inc.
Citation: Sharma, R., Dhakad, N. S., Reddy, G. S., Sharma, V., & Vishvakarma, S. K. (2024). ReCAM: Resistive RAM Digital Content Addressable Memory Using Novel 3T1R Bitcell. IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Scopus. https://doi.org/10.1109/EDTM58488.2024.10511788
Abstract: The demands of data-intensive applications necessitate solutions that are high-speed and energy-efficient and deliver superior performance. Non-volatile memory devices, such as Resistive Random Access Memory (ReRAM), have emerged as promising options for enhancing computing systems. In this study, we introduce an innovative 3T1R bitcell designed specifically for Content Addressable Memory (CAM) operations, implemented at the 65nm CMOS technology node. Our proposed design exhibits notable advantages such as 1.27x reduction in sensing latency and a 2.67x decrease in search energy consumption for a 64-bit word size compared to the current state-of-the-art. Furthermore, the design ensures reliable and robust performance across various process corners and temperature variations. © 2024 IEEE.
URI: https://doi.org/10.1109/EDTM58488.2024.10511788
https://dspace.iiti.ac.in/handle/123456789/14049
ISBN: 979-8350371529
Type of Material: Conference Paper
Appears in Collections:Department of Electrical Engineering

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