Study on Actuation Characteristics of NiTiCu SMA Thin Film Deposited on Flexible Substrate

Abstract

In this work, the actuation of NiTiCu Shape Memory Alloy (SMA) bimorph is studied using Joule heating setup. The characterization of NiTiCu SMA thin film is carried out using Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD), optical microscope and scotch tape analysis. The actuation study was carried out and the maximum displacement was found at 4 V and 3 A which was about 1.2 mm. The optical microscope images taken after the actuation studies show the removal of the film where contacts are made. The film burnt when the voltage is further increased resulting in the reduction in displacement. The NiTiCu film can be used for Micro Electro Mechanical System (MEMS) application considering the power requirement will be low when compared to NiTi thin film and also can be used for various applications. © 2019, Springer Nature Singapore Pte Ltd.