Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/15637
Title: Design of Low-Complexity Quantized Compressive Sensing Using Measurement Predictive Coding
Authors: Appina, Balasubramanyam
Keywords: Compressive sensing (CS);intraprediction;intrapredictive coding;JPEG compression;predictive coding
Issue Date: 2025
Publisher: Institute of Electrical and Electronics Engineers Inc.
Citation: Bhanuprakash Reddy Konduru, L., Pudi, V., & Appina, B. (2025). Design of Low-Complexity Quantized Compressive Sensing Using Measurement Predictive Coding. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. Scopus. https://doi.org/10.1109/TVLSI.2024.3438249
Abstract: Block-based compressive sensing (BCS) has evolved as a promising method for smart devices with limited bandwidth and computing capabilities, striking a balance between image/video quality and transmission efficiency. Despite its advantages, BCS falls short in reducing bitrate compared with traditional acquisition systems, because it increases the number of bits per measurement, which leads to high storage and transmission costs. In this context, we propose a measurement predictive coding (MPC) along with the quantization method in integration with BCS named BCS-MPC
here, we have performed the quantization with bit shifts only instead of binary division. The proposed method reduces the number of bits per compressive sensing (CS) measurement as well as the transmission of the quantization step size. Furthermore, it reduces the latency and hardware resources. The proposed method improved on average +3.44 to +8.28 dB in PSNR over the current works. From the synthesis results, the proposed BCS-MPC method requires 26.11%, 18.89%, and 82.53% less area, power, and delay over the existing work. We have achieved a reduction in delay with bit-shift operations. © 1993-2012 IEEE.
URI: https://doi.org/10.1109/TVLSI.2024.3438249
https://dspace.iiti.ac.in/handle/123456789/15637
ISSN: 1063-8210
Type of Material: Journal Article
Appears in Collections:Department of Electrical Engineering

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