Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/16340
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dc.contributor.authorMishra, Rakeshen_US
dc.contributor.authorRajak, Ashishen_US
dc.date.accessioned2025-06-27T13:11:28Z-
dc.date.available2025-06-27T13:11:28Z-
dc.date.issued2025-
dc.identifier.citationMishra, R. K., & Rajak, A. (2025). Experimental, analytical, and numerical analysis of clinched-assisted electromagnetic forming of AA1100 sheet. Materials Research Proceedings, 54, 1239–1248. https://doi.org/10.21741/9781644903599-135en_US
dc.identifier.issn2474-3941-
dc.identifier.otherEID(2-s2.0-105008070587)-
dc.identifier.urihttps://dx.doi.org/10.21741/9781644903599-135-
dc.identifier.urihttps://dspace.iiti.ac.in:8080/jspui/handle/123456789/16340-
dc.description.abstractAA1100 sheets have vast applications in the automobile, aerospace, heat exchangers, and nuclear industries. Clinching is a mechanical joining method using a simple tool set consisting of a punch, a die, and a punch holder. Electromagnetic forming (EMF) is a high-strain rate forming process that uses the Lorentz force to shape the workpiece. This manuscript compares the formability analysis of electromagnetic forming of the clinched and non-clinched workpieces of a thickness of 1 mm. Two sheets of the same thickness were clinched along the width. Analytical studies were conducted to calculate a magnetic field developed in the rectangular spiral coil. Furthermore, a numerical analysis was carried out using an LS DYNA explicit solver for clinching and EMF processes to verify the experimental results. © 2025, Association of American Publishers. All rights reserved.en_US
dc.language.isoenen_US
dc.publisherAssociation of American Publishersen_US
dc.sourceMaterials Research Proceedingsen_US
dc.subjectClinchingen_US
dc.subjectElectromagnetic Formingen_US
dc.subjectFiber Backing Plateen_US
dc.subjectLS DYNAen_US
dc.titleExperimental, analytical, and numerical analysis of clinched-assisted electromagnetic forming of AA1100 sheeten_US
dc.typeConference Paperen_US
Appears in Collections:Department of Mechanical Engineering

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