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Title: | Simultaneous measurement of thickness and refractive index using wedge plate lateral shearing interferometry and fourier transform method |
Authors: | Chatterjee, Amit Dhanotia, Jitendra Bhatia, Vimal Disawal, Reena |
Keywords: | Fourier transforms;Interferometry;Shearing;Thickness measurement;Wavefronts;Fourier fringe analysis;Fourier fringe analysis technique;Fourier transform method;Lateral shearing interferometry;Simultaneous measurement;Spatial filterings;Thickness;Transparent glass plates;Refractive index |
Issue Date: | 2018 |
Publisher: | Institute of Electrical and Electronics Engineers Inc. |
Citation: | Chatterjee, A., Dhanotia, J., Bhatia, V., Disawal, R., & Prakash, S. (2018). Simultaneous measurement of thickness and refractive index using wedge plate lateral shearing interferometry and fourier transform method. Paper presented at the 2017 6th International Conference on Computer Applications in Electrical Engineering - Recent Advances, CERA 2017, , 2018-January 381-384. doi:10.1109/CERA.2017.8343359 |
Abstract: | We propose a technique for simultaneous measurement of thickness and refractive index (RI) using wedge plate lateral shearing interferometry combined with Fourier fringe analysis. Collimated light beam transmitted through transparent glass plate (GP) is analyzed by a wedge plate and spatial filtering arrangement. Wedge plate displaces incident wavefront by a small amount. Fringe pattern is obtained by interference of original and displaced wavefronts. To extract the information of thickness and RI simultaneously, the specimen is rotated and the phase variation of interferograms before and after rotation are determined using Fourier fringe analysis technique. © 2017 IEEE. |
URI: | https://doi.org/10.1109/CERA.2017.8343359 https://dspace.iiti.ac.in/handle/123456789/5257 |
ISBN: | 9781509048748 |
Type of Material: | Conference Paper |
Appears in Collections: | Department of Electrical Engineering |
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