Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/5257
Title: Simultaneous measurement of thickness and refractive index using wedge plate lateral shearing interferometry and fourier transform method
Authors: Chatterjee, Amit
Dhanotia, Jitendra
Bhatia, Vimal
Disawal, Reena
Keywords: Fourier transforms;Interferometry;Shearing;Thickness measurement;Wavefronts;Fourier fringe analysis;Fourier fringe analysis technique;Fourier transform method;Lateral shearing interferometry;Simultaneous measurement;Spatial filterings;Thickness;Transparent glass plates;Refractive index
Issue Date: 2018
Publisher: Institute of Electrical and Electronics Engineers Inc.
Citation: Chatterjee, A., Dhanotia, J., Bhatia, V., Disawal, R., & Prakash, S. (2018). Simultaneous measurement of thickness and refractive index using wedge plate lateral shearing interferometry and fourier transform method. Paper presented at the 2017 6th International Conference on Computer Applications in Electrical Engineering - Recent Advances, CERA 2017, , 2018-January 381-384. doi:10.1109/CERA.2017.8343359
Abstract: We propose a technique for simultaneous measurement of thickness and refractive index (RI) using wedge plate lateral shearing interferometry combined with Fourier fringe analysis. Collimated light beam transmitted through transparent glass plate (GP) is analyzed by a wedge plate and spatial filtering arrangement. Wedge plate displaces incident wavefront by a small amount. Fringe pattern is obtained by interference of original and displaced wavefronts. To extract the information of thickness and RI simultaneously, the specimen is rotated and the phase variation of interferograms before and after rotation are determined using Fourier fringe analysis technique. © 2017 IEEE.
URI: https://doi.org/10.1109/CERA.2017.8343359
https://dspace.iiti.ac.in/handle/123456789/5257
ISBN: 9781509048748
Type of Material: Conference Paper
Appears in Collections:Department of Electrical Engineering

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