Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/6722
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dc.contributor.authorJain, Neelesh Kumaren_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-21T10:51:11Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-21T10:51:11Z-
dc.date.issued2016-
dc.identifier.citationGupta, K., Jain, N. K., & Laubscher, R. F. (2016). Thermal hybrid machining processes doi:10.1007/978-3-319-25922-2_3en_US
dc.identifier.issn2191-530X-
dc.identifier.otherEID(2-s2.0-85028769963)-
dc.identifier.urihttps://doi.org/10.1007/978-3-319-25922-2_3-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/6722-
dc.description.abstractThis chapter describes thermal-type HMPs in which EDM as the primary process of material removal is combined with either a conventional machining/finishing process or with an electrolytic dissolution-based process for improved machining/finishing characteristics and workpiece surface integrity. This hybridization enables thermal HMPs to reduce processing times by 2 to 3 times when compared to their constituent processes while producing surface finishes up to 0.1 µm. Some of the important applications of thermal HMPs are as follows: drilling of micro-holes and the production of slits in quartz and glass, machining of metal matrix composites and ceramics, and dressing of grinding wheels. © The Author(s) 2016.en_US
dc.language.isoenen_US
dc.publisherSpringer Verlagen_US
dc.sourceSpringerBriefs in Applied Sciences and Technologyen_US
dc.subjectAbrasionen_US
dc.subjectDiamondsen_US
dc.subjectDischarge (fluid mechanics)en_US
dc.subjectElectrolysisen_US
dc.subjectMachiningen_US
dc.subjectMetallic matrix compositesen_US
dc.subjectWheel dressingen_US
dc.subjectCeramics industryen_US
dc.subjectGlass industryen_US
dc.subjectConventional machiningen_US
dc.subjectElectrochemicalen_US
dc.subjectElectrolytic dissolutionen_US
dc.subjectGas filmsen_US
dc.subjectHybrid machining processen_US
dc.subjectPyrexen_US
dc.subjectSurface finishesen_US
dc.subjectSurface integrityen_US
dc.subjectMaterial removalen_US
dc.subjectMicro holesen_US
dc.subjectProcessing timeen_US
dc.subjectGrinding (machining)en_US
dc.titleThermal hybrid machining processesen_US
dc.typeBook Chapteren_US
Appears in Collections:Department of Mechanical Engineering

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