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Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/6785
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dc.contributor.authorKothari, Rohiten_US
dc.contributor.authorSahu, Santosh Kumaren_US
dc.contributor.authorKundalwal, Shaileshen_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-21T10:51:20Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-21T10:51:20Z-
dc.date.issued2018-
dc.identifier.citationKothari, R., Mahalkar, P., Sahu, S. K., & Kundalwal, S. I. (2018). Experimental investigations on thermal performance of pcm based heat sink for passive cooling of electronic components. Paper presented at the ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2018, doi:10.1115/icnmm2018-7732en_US
dc.identifier.isbn9780791851197-
dc.identifier.otherEID(2-s2.0-85088066532)-
dc.identifier.urihttps://doi.org/10.1115/icnmm2018-7732-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/6785-
dc.description.abstractIn the present experimental study, an attempt has been made to study the efficient thermal management system based on phase change material for cooling of portable electronic devices. Paraffin wax is used as PCM to keep the temperature of electronic devices below critical temperature by absorbing thermal energy released by electronic components. PCM is filled inside the heat sink made of aluminum. Four different configuration of heat sink such as unfinned heat sink filled with pure PCM, two finned heat sink filled with pure PCM, unfinned heat sink filled with MF-PCM composite and two finned heat sink filled with MF-PCM composite are used in the present investigation to enhance the operating time of heat sink to reach critical set point temperature. Unfinned heat sink filled with and without PCM is used for baseline comparison. Effect of volume fraction of PCM, effect of heat flux and enhancement in operating time are reported in this study. Enhancement ratios are obtained for various heat sink configurations. The comparison of thermal performance of different configuration shows that higher enhancement ratio and effective thermal control is obtained with two finned metal foam heat sink. Copyright © 2018 ASME.en_US
dc.language.isoenen_US
dc.publisherAmerican Society of Mechanical Engineers (ASME)en_US
dc.sourceASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2018en_US
dc.subjectElectronic coolingen_US
dc.subjectElectronic equipmenten_US
dc.subjectFoam controlen_US
dc.subjectHeat fluxen_US
dc.subjectMetal foamsen_US
dc.subjectMetalsen_US
dc.subjectMicrochannelsen_US
dc.subjectNetwork componentsen_US
dc.subjectPhase change materialsen_US
dc.subjectThermal variables controlen_US
dc.subjectThermoelectric equipmenten_US
dc.subjectCritical temperaturesen_US
dc.subjectElectronic componenten_US
dc.subjectEnhancement ratiosen_US
dc.subjectExperimental investigationsen_US
dc.subjectPortable electronic devicesen_US
dc.subjectSet-point temperaturesen_US
dc.subjectThermal management systemsen_US
dc.subjectThermal Performanceen_US
dc.subjectHeat sinksen_US
dc.titleExperimental investigations on thermal performance of pcm based heat sink for passive cooling of electronic componentsen_US
dc.typeConference Paperen_US
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