Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/6842
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dc.contributor.authorSahu, Santosh Kumaren_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-21T10:51:29Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-21T10:51:29Z-
dc.date.issued2015-
dc.identifier.citationShewale, S. P., Sahu, S. K., Chougule, S. S., & Pise, A. T. (2015). A review of heat pipe with nanofluid for electronic cooling. Paper presented at the 2014 International Conference on Advances in Engineering and Technology, ICAET 2014, doi:10.1109/ICAET.2014.7105296en_US
dc.identifier.isbn9781479949496-
dc.identifier.otherEID(2-s2.0-84933566112)-
dc.identifier.urihttps://doi.org/10.1109/ICAET.2014.7105296-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/6842-
dc.description.abstractA heat pipe is an important tool for effective cooling performance of the electronic devices. The main focus of this paper is to review applications of heat pipe in electronic system. Miniaturization of chips and increasing processing speed decreases the heat transfer surface area and generates very high heat fluxes resulting in large temperature rise in electronics devices. Therefore, for an effective cooling heat pipe is a better selection because of its high efficiency and reliability. A major part of this review paper is allocated to applications of different types of heat pipe and modern trends in heat pipe technology. Nanofluids are dilute suspensions of nanoparticles composite materials with the specific aim of increasing the thermal conductivity of heat transfer fluids. Authors also analyzed some of the applications of heat pipes with nanofluid for electronic cooling. © 2014 IEEE.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.source2014 International Conference on Advances in Engineering and Technology, ICAET 2014en_US
dc.subjectCoolingen_US
dc.subjectHeat fluxen_US
dc.subjectHeat pipesen_US
dc.subjectHeat transferen_US
dc.subjectNanofluidicsen_US
dc.subjectSuspensions (fluids)en_US
dc.subjectThermal conductivityen_US
dc.subjectCooling performanceen_US
dc.subjectDilute suspensionsen_US
dc.subjectElectronics devicesen_US
dc.subjectHeat pipe technologyen_US
dc.subjectHeat transfer surface areaen_US
dc.subjectNanofluidsen_US
dc.subjectTypes of heat pipesen_US
dc.subjectVery high heat fluxen_US
dc.subjectElectronic coolingen_US
dc.titleA review of heat pipe with nanofluid for electronic coolingen_US
dc.typeConference Paperen_US
Appears in Collections:Department of Mechanical Engineering

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