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Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/7147
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dc.contributor.authorKumar, Akashen_US
dc.contributor.authorMani Prabu, S. S.en_US
dc.contributor.authorJayachandran, Shanthien_US
dc.contributor.authorPalani, Anand Iyamperumalen_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-21T10:52:42Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-21T10:52:42Z-
dc.date.issued2018-
dc.identifier.citationAkash, K., Mani Prabu, S. S., Gustmann, T., Jayachandran, S., Pauly, S., & Palani, I. A. (2018). Enhancing the life cycle behaviour of cu-al-ni shape memory alloy bimorph by mn addition. Materials Letters, 226, 55-58. doi:10.1016/j.matlet.2018.05.008en_US
dc.identifier.issn0167-577X-
dc.identifier.otherEID(2-s2.0-85046636535)-
dc.identifier.urihttps://doi.org/10.1016/j.matlet.2018.05.008-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/7147-
dc.description.abstractCu-Al-Ni and Cu-Al-Ni-Mn shape memory alloys are deposited on Kapton polyimide sheets by a physical evaporation technique. Detailed investigations on the morphological, structural and thermal behaviour of the ternary and quaternary alloys are conducted. The developed samples exhibit an increase in martensite structures and decrease in transformation temperatures after Mn additions. Furthermore, the suppression of Cu3Al precipitates was evident from XRD analysis. The thermomechanical behaviour was analysed by actuating the bimorphs through Joule heating under varying mechanical loads. Fatigue analysis of the bimorphs reveals a superior performance for Cu-Al-Ni-Mn, exhibiting less than 30% loss in displacement after 15,000 cycles. © 2018en_US
dc.language.isoenen_US
dc.publisherElsevier B.V.en_US
dc.sourceMaterials Lettersen_US
dc.subjectCopper alloysen_US
dc.subjectLife cycleen_US
dc.subjectManganese alloysen_US
dc.subjectNickel alloysen_US
dc.subjectPolyimidesen_US
dc.subjectShape memory effecten_US
dc.subjectTernary alloysen_US
dc.subjectThin filmsen_US
dc.subjectActuationen_US
dc.subjectBimorphen_US
dc.subjectCu-Al-Nien_US
dc.subjectCu-Al-Ni shape memoryen_US
dc.subjectMartensite structuresen_US
dc.subjectThermo-mechanicalen_US
dc.subjectThermomechanical behaviouren_US
dc.subjectTransformation temperaturesen_US
dc.subjectAluminum alloysen_US
dc.titleEnhancing the life cycle behaviour of Cu-Al-Ni shape memory alloy bimorph by Mn additionen_US
dc.typeJournal Articleen_US
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