Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/7269
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dc.contributor.authorPalani, Anand Iyamperumalen_US
dc.date.accessioned2022-03-17T01:00:00Z-
dc.date.accessioned2022-03-21T10:53:20Z-
dc.date.available2022-03-17T01:00:00Z-
dc.date.available2022-03-21T10:53:20Z-
dc.date.issued2016-
dc.identifier.citationBhimasingu, V., Pannirselvam, E., Vasa, N. J., & Palani, I. A. (2016). Influence of target grit count and sintering temperature on pulsed laser deposition of SiC thin films. International Journal of Advanced Manufacturing Technology, 84(5-8), 769-776. doi:10.1007/s00170-014-5622-0en_US
dc.identifier.issn0268-3768-
dc.identifier.otherEID(2-s2.0-84896690224)-
dc.identifier.urihttps://doi.org/10.1007/s00170-014-5622-0-
dc.identifier.urihttps://dspace.iiti.ac.in/handle/123456789/7269-
dc.description.abstractA pulsed laser deposition (PLD) technique for depositing SiC on Si(100) substrates using Nd3+:YAG laser at 355 nm is studied. The influence of substrate temperature, ambient pressure, and SiC powder grit size on both structure and morphology of SiC thin film is investigated. Further, the influence of the target preparation on the reduction of droplet formation during Nd3+:YAG laser-assisted pulsed laser deposition of SiC thin films is investigated. Experimental studies show that multicrystalline SiC film can be obtained with temperature ranging from 600 to 700 °C and at an ambient pressure of about 5.5 × 10−3 Pa. Further, droplet formation on the deposited film was reduced significantly by selecting the grit count of SiC powder 500 and the pressure of 2 × 10−2 Pa. SiC target sintered at 1,600 °C showed a reduced wear during the laser ablation. The X-ray diffraction (XRD) and the Raman spectroscopy studies on deposited films clearly show the multicrystalline (combined 3C-SiC and 4H-SiC) nature of SiC films. I-V characteristics of deposited SiC film on n-type c-Si substrate also indicated that SiC thin film possesses P-type semiconductor properties. © 2014, Springer-Verlag London.en_US
dc.language.isoenen_US
dc.publisherSpringer Londonen_US
dc.sourceInternational Journal of Advanced Manufacturing Technologyen_US
dc.subjectDepositionen_US
dc.subjectDrop formationen_US
dc.subjectDropsen_US
dc.subjectFilm preparationen_US
dc.subjectLaser ablationen_US
dc.subjectPulsed laser depositionen_US
dc.subjectPulsed lasersen_US
dc.subjectSemiconducting siliconen_US
dc.subjectSemiconductor lasersen_US
dc.subjectSilicon carbideen_US
dc.subjectSinteringen_US
dc.subjectSubstratesen_US
dc.subjectWide band gap semiconductorsen_US
dc.subjectX ray diffractionen_US
dc.subjectGrit counten_US
dc.subjectIV characteristicsen_US
dc.subjectP type semiconductoren_US
dc.subjectPhotovoltaicsen_US
dc.subjectSintering temperaturesen_US
dc.subjectStructure and morphologyen_US
dc.subjectSubstrate temperatureen_US
dc.subjectTarget preparationen_US
dc.subjectThin filmsen_US
dc.titleInfluence of target grit count and sintering temperature on pulsed laser deposition of SiC thin filmsen_US
dc.typeJournal Articleen_US
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