Phase change material based heat sinks for thermal management of electronic devices

Abstract

The current research examines the thermal performance of Nano-enhanced Phase Change Material (NePCM) based Heat Sinks for electronic component cooling. CuO and Al2O3 are employed as nanoparticles, while Paraffin wax with a melting range of 53 to 58 degrees Celsius is used as a Phase Changing material, with aluminum heat sinks. Tests are carried out with a constant volume fraction of 6.60 percent of fins in each heat sink for various configurations (no fin, 1x1 fin, 2x2 fin, 3x3 fin, 4x4 fin, 5x5 fin, and 6x6 fins). The nanoparticle concentration varies (0, 0.5,1 %wt). The heating plate imitates heat-producing electrical gadget which is linked to the bottom of the heat sink. All tests are carried out at a steady heat flux of 2.5 kW/m2. The properties of NePCM varies with variation in concentration of nanoparticles. With increase in concentration of nanoparticles, the density and thermal conductivity increases. Moreover, the higher thermal conductivity is found in case of Al2O3. The highest thermal conductivity of 0.58W/m-k is in case of 1% Al2O3. It is found that the pure PCM stretches the operating time for electronic devices to reach 75C base temperature by 190% as compared to case of heat sink without PCM. The maximum operating time is found to be 2920s in case of 6x6 with pure PCM and 2820s in case of 4x4 with 1% Al2O3. Best enhancement ratio of 4.62 and 4.47 is also found these two cases.