Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/11241
Title: Fast High-Resolution Fingerprint Recognition using Domain-Knowledge Infused Global Descriptors
Authors: Nema, Aneesh
Anand, Vijay
Kanhangad, Vivek
Keywords: Computer vision;Deep learning;Palmprint recognition;Computational performance;Domain knowledge;Fingerprint Recognition;Global Descriptors;High resolution;Learning models;Local descriptors;Performance;Template sizes;Variable number;Domain Knowledge
Issue Date: 2022
Publisher: Institute of Electrical and Electronics Engineers Inc.
Citation: Nema, A., Anand, V., & Kanhangad, V. (2022). Fast high-resolution fingerprint recognition using domain-knowledge infused global descriptors. Paper presented at the AVSS 2022 - 18th IEEE International Conference on Advanced Video and Signal-Based Surveillance, doi:10.1109/AVSS56176.2022.9959396 Retrieved from www.scopus.com
Abstract: High-resolution fingerprint recognition is mainly centred around local descriptors created using pore patches. Although these methods provide good verification performance, they are not well-suited for identification due to poor computational performance and variable and large template size caused by the variable number of useful pore patches. We present a deep learning model that overcomes this problem by learning to generate a fixed-sized global descriptor while also taking into account the finer level-3 features by infusing domain knowledge using a multi-task architecture. Our approach employs a CNN with two branches simultaneously trained to generate descriptors and pore-intensity maps. We have augmented a publicly available dataset (IITI-HRF) for performance evaluation. Our method compares favorably to the state-of-the-art in terms of accuracy, while being significantly faster (∼ 24× for verification and ∼ 518000× for identification) and having a smaller template size. © 2022 IEEE.
URI: https://doi.org/10.1109/AVSS56176.2022.9959396
https://dspace.iiti.ac.in/handle/123456789/11241
ISBN: 978-1665463829
ISSN: 0000-0000
Type of Material: Conference Paper
Appears in Collections:Department of Electrical Engineering

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