Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/4635
Title: Reliability and threat analysis of NBTI stress on DSP cores
Authors: Sengupta, Anirban
Kachave, Deepak
Neema, Shubha
Panugothu, Sri Harsha
Keywords: Degradation;Failure (mechanical);Information systems;Information use;Nanoelectronics;Negative bias temperature instability;Reliability analysis;Thermodynamic stability;Threshold voltage;Vectors;Delay;Device degradation;Digital signal processing (DSP);DSP core;Input vector;Negative bias temperature instability (NBTI);Performance comparison;Performance degradation;Digital signal processing
Issue Date: 2018
Publisher: Institute of Electrical and Electronics Engineers Inc.
Citation: Sengupta, A., Kachave, D., Neema, S., & Panugothu, S. H. (2018). Reliability and threat analysis of NBTI stress on DSP cores. Paper presented at the Proceedings - 2017 IEEE International Symposium on Nanoelectronic and Information Systems, iNIS 2017, , 2018-February 11-14. doi:10.1109/iNIS.2017.12
Abstract: Device aging is a critical failure mechanism in nanoscale designs. Prolonged device degradation may result in failure. Delay degradation of a design depends on various factors such as threshold voltage, temperature, input vector pattern etc. An attacker who is aware of this phenomenon may exploit by accelerating the performance degradation mechanism. This paper proposes a novel reliability and threat analysis of negative bias temperature instability (NBTI) stress on digital signal processing (DSP) cores. The main contributions of this paper are as follows: (a) identifying input vectors that cause maximum degradation of DSP cores due to NBTI stress (b) analyzing impact of NBTI stress for varying stress time on DSP core in terms of delay degradation (c) analyzing performance comparison of stress vs. no-stress condition for various input vector samples. © 2017 IEEE.
URI: https://doi.org/10.1109/iNIS.2017.12
https://dspace.iiti.ac.in/handle/123456789/4635
ISBN: 9781538613566
Type of Material: Conference Paper
Appears in Collections:Department of Computer Science and Engineering

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