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Title: | Analytical modeling for 3D potential distribution of rectangular gate (RecG) gate-all-around (GAA) MOSFET in subthreshold and strong inversion regions |
Authors: | Vishvakarma, Santosh Kumar |
Keywords: | Characteristic length;Gate-all-around MOSFET;Potential;Rectangular gate (RecG);Strong inversion;Gallium alloys;MOSFET devices;Poisson equation;Three dimensional |
Issue Date: | 2012 |
Citation: | Sharma, D., & Kumar Vishvakarma, S. (2012). Analytical modeling for 3D potential distribution of rectangular gate (RecG) gate-all-around (GAA) MOSFET in subthreshold and strong inversion regions. Microelectronics Journal, 43(6), 358-363. doi:10.1016/j.mejo.2012.02.001 |
Abstract: | In this paper, we have introduced an analytical subthreshold and strong inversion 3D potential model for rectangular gate (RecG) gate-all-around (GAA) MOSFET. The subthreshold and strong inversion potential distribution in channel region of a RecG MOSFET is obtained respectively by solving 3D Laplace and 3D Poisson equations. The assumed parabolic potential distribution along the z-axis in channel direction is appropriately matched with 3D device simulator after consideration of z-depended characteristic length in subthreshold region. For accurate estimation of short channel effects (SCE), the electrostatics near source and drain is corrected. The precise gate-to-gate potential distribution is obtained after consideration of higher order term in assumed parabolic potential profile. The model compares well with numerical data obtained from the 3D ATLAS as a device simulator and deckbuild as an interactive runtime of Silvaco Inc. © 2012 Elsevier Ltd. All rights reserved. |
URI: | https://doi.org/10.1016/j.mejo.2012.02.001 https://dspace.iiti.ac.in/handle/123456789/6152 |
ISSN: | 0026-2692 |
Type of Material: | Journal Article |
Appears in Collections: | Department of Electrical Engineering |
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