Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/6876
Title: On wire breakage and microstructure in WEDC of SiCp/6061 aluminum metal matrix composites
Authors: Jain, Neelesh Kumar
Keywords: Aluminum metal matrix composites;Machined surface;Machining Accuracy;Material removal rate;Metal matrix composites;Process parameters;Wire breakages;Wire electric discharge machining;Aluminum;Electric discharges;Machining;Metallic matrix composites;Microstructure;Silicon carbide;Surface roughness;Wire
Issue Date: 2012
Citation: Shandilya, P., Jain, P. K., & Jain, N. K. (2012). On wire breakage and microstructure in WEDC of SiCp/6061 aluminum metal matrix composites. International Journal of Advanced Manufacturing Technology, 61(9-12), 1199-1207. doi:10.1007/s00170-012-4095-2
Abstract: Unconventional machining like wire electric discharge machining/cutting (WEDM/WEDC) seems to be a better choice for machining/cutting the metal matrix composites (MMCs) because it offers easy control and has the capability of machining intricate complex shapes. But wire breakage in the WEDM/WEDC process decreases the machining accuracy and the quality of the machined surface. This paper describes the effect of four input process parameters (i.e., servo voltage, pulse-on time, pulse-off time, and wire feed rate) on wire breakage frequency and the microstructure of the cut surface during WEDC of SiC p/6061 Al MMC. An optimum range of input parameters has been bracketed as the outcome of this work for determining the effects of input process parameters on the average cutting speed, material removal rate, and surface roughness during WEDC of SiCp/6061 Al MMC. This range of input parameters can also be used for carrying out further research to develop the models for WEDC of SiCp/6061 Al MMC and to optimize the WEDC parameters for smooth cutting. © 2012 Springer-Verlag London Limited.
URI: https://doi.org/10.1007/s00170-012-4095-2
https://dspace.iiti.ac.in/handle/123456789/6876
ISSN: 0268-3768
Type of Material: Conference Paper
Appears in Collections:Department of Mechanical Engineering

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