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Title: | A review of heat pipe with nanofluid for electronic cooling |
Authors: | Sahu, Santosh Kumar |
Keywords: | Cooling;Heat flux;Heat pipes;Heat transfer;Nanofluidics;Suspensions (fluids);Thermal conductivity;Cooling performance;Dilute suspensions;Electronics devices;Heat pipe technology;Heat transfer surface area;Nanofluids;Types of heat pipes;Very high heat flux;Electronic cooling |
Issue Date: | 2015 |
Publisher: | Institute of Electrical and Electronics Engineers Inc. |
Citation: | Shewale, S. P., Sahu, S. K., Chougule, S. S., & Pise, A. T. (2015). A review of heat pipe with nanofluid for electronic cooling. Paper presented at the 2014 International Conference on Advances in Engineering and Technology, ICAET 2014, doi:10.1109/ICAET.2014.7105296 |
Abstract: | A heat pipe is an important tool for effective cooling performance of the electronic devices. The main focus of this paper is to review applications of heat pipe in electronic system. Miniaturization of chips and increasing processing speed decreases the heat transfer surface area and generates very high heat fluxes resulting in large temperature rise in electronics devices. Therefore, for an effective cooling heat pipe is a better selection because of its high efficiency and reliability. A major part of this review paper is allocated to applications of different types of heat pipe and modern trends in heat pipe technology. Nanofluids are dilute suspensions of nanoparticles composite materials with the specific aim of increasing the thermal conductivity of heat transfer fluids. Authors also analyzed some of the applications of heat pipes with nanofluid for electronic cooling. © 2014 IEEE. |
URI: | https://doi.org/10.1109/ICAET.2014.7105296 https://dspace.iiti.ac.in/handle/123456789/6842 |
ISBN: | 9781479949496 |
Type of Material: | Conference Paper |
Appears in Collections: | Department of Mechanical Engineering |
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