Effect of silver coating on silicon ingot slicing by wire-EDM process

Abstract

The wire-EDM process for silicon ingot slicing is helpful in minimizing wafer thickness and kerf loss. However, the cutting rate of the process must be improved to make it as a potential alternative to abrasive wire saw process. This paper describes the effect of silver coating on silicon in increasing the cutting rate by reducing the contact resistance between the electrodes. It also addresses the effect of silver coating on kerf width and surface roughness which are important for silicon ingot slicing process. While the silver coating of silicon improves cutting rate by 40%, thermal modeling of the cutting process corroborates the improvement in the cutting rate.