Please use this identifier to cite or link to this item: https://dspace.iiti.ac.in/handle/123456789/7147
Title: Enhancing the life cycle behaviour of Cu-Al-Ni shape memory alloy bimorph by Mn addition
Authors: Kumar, Akash
Mani Prabu, S. S.
Jayachandran, Shanthi
Palani, Anand Iyamperumal
Keywords: Copper alloys;Life cycle;Manganese alloys;Nickel alloys;Polyimides;Shape memory effect;Ternary alloys;Thin films;Actuation;Bimorph;Cu-Al-Ni;Cu-Al-Ni shape memory;Martensite structures;Thermo-mechanical;Thermomechanical behaviour;Transformation temperatures;Aluminum alloys
Issue Date: 2018
Publisher: Elsevier B.V.
Citation: Akash, K., Mani Prabu, S. S., Gustmann, T., Jayachandran, S., Pauly, S., & Palani, I. A. (2018). Enhancing the life cycle behaviour of cu-al-ni shape memory alloy bimorph by mn addition. Materials Letters, 226, 55-58. doi:10.1016/j.matlet.2018.05.008
Abstract: Cu-Al-Ni and Cu-Al-Ni-Mn shape memory alloys are deposited on Kapton polyimide sheets by a physical evaporation technique. Detailed investigations on the morphological, structural and thermal behaviour of the ternary and quaternary alloys are conducted. The developed samples exhibit an increase in martensite structures and decrease in transformation temperatures after Mn additions. Furthermore, the suppression of Cu3Al precipitates was evident from XRD analysis. The thermomechanical behaviour was analysed by actuating the bimorphs through Joule heating under varying mechanical loads. Fatigue analysis of the bimorphs reveals a superior performance for Cu-Al-Ni-Mn, exhibiting less than 30% loss in displacement after 15,000 cycles. © 2018
URI: https://doi.org/10.1016/j.matlet.2018.05.008
https://dspace.iiti.ac.in/handle/123456789/7147
ISSN: 0167-577X
Type of Material: Journal Article
Appears in Collections:Department of Mechanical Engineering

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